AMD have just confirmed they are working with Intel to create a new eighth generation premium mobile processor with Radeon graphics. The executive added that together, they are offering gamers and content creators the opportunity to have a thinner and lighter PC that is capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. Nevertheless, Intel did pointed out that the new processor is combination of Intel Core H-series CPU together with a semi-custom AMD Radeon GPU.
It's been a busy year, with AMD making a rare return to form at the start of Q1, to Intel rushing out a launch of their own at the end of the year in response - the status quo has certainly taken a hit. Intel processors work great on operating systems that use the Linux kernel, but discrete graphics such as those from AMD can be problematic.
Intel and AMD are rivals in the same industry and yet they've teamed up to develop a new laptop chip, possibly to take on NVIDIA. This will be the first use of EMIB, and another technology that covers the chips, with this other being a power sharing framework. It's described as a small intelligent bridge "that allows heterogeneous silicon to quickly pass information in extremely close proximity". Intel calls the EMIB the heart of the chip unit design, and the company says that it eliminates height impact and greatly reduces manufacturing and design complexities. At the outset, AMD is treating the Radeon core as a single-, semi-custom design similar to the custom graphics it supplies for game consoles like the Xbox One X and PlayStation 4. We had a good laugh seeing that Intel's PR is quoting AMD's Scott Herkelman, an ex-Nvidia Geforce guy. It included facilities to manage temperature, power delivery and performance states in real time and adjust performance balance depending upon tasks. Nvidia holds almost 80% of the market for stand-alone graphics chips by revenue, in direct competition with AMD, and competes with Intel on artificial intelligence chips for large corporations, the Wall Street Journal noted.
The processor package incorporates an 8 Generation Core H-Series processor, AMD's Radeon Vega GPU and HMB2 memory. In this case, this collaboration with AMD will enable thinner, lighter and more powerful notebook PCs that are as little as 11mm thick (although Intel contends that 16mm or less is the prime target). Despite the power involved, the unified design is hoped to be easier on battery life than some current solutions.